HCS165MS

FN2481 Rev 2.00

Page 9 of 9

September 1995

Die Characteristics

DIE DIMENSIONS:

95 x 94 mils

METALLIZATION:

Type: AlSi

Metal Thickness: 11k

Å 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13k

Å  2.6kÅ

WORST CASE CURRENT DENSITY:

< 2.0 x 105A/cm2

BOND PAD SIZE:

100

m x 100m

4 x 4 mils

Metallization Mask Layout

HCS165MS

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask

series for the HCS165 is TA14385A.

CP

PL

VCC

D4 (3)

D5 (4)

D6 (5)

(6)

(8)

(9)

(10)

(11) D0

(12) D1

(13) D2

(14)

(2)

(1)

(16)

GND

Q7

DS

(7)

(15)

D7

Q7

D3

CE