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HCS573D Arkusz danych(PDF) 4 Page - Renesas Technology Corp

Numer części HCS573D
Szczegółowy opis  Radiation Hardened Octal Transparent Latch, Three-State
PDF  10 Pages
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Producent  RENESAS [Renesas Technology Corp]
Strona internetowa  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

HCS573D Arkusz danych(HTML) 4 Page - Renesas Technology Corp

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HCS573MS
FN4056 Rev 0.00
Page 4 of 10
September 1995
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
SYMBOL
(NOTES 1, 2)
CONDITIONS
GROUP
A SUB-
GROUPS
TEMPERATURE
LIMITS
UNITS
MIN
MAX
Data to Qn
TPLH
TPHL
VCC = 4.5V
9
+25oC
2
24
ns
10, 11
+125oC, -55oC
2
29
ns
LE to Qn
TPLH
VCC = 4.5V
9
+25oC
2
27
ns
10, 11
+125oC, -55oC
2
35
ns
TPHL
VCC = 4.5V
9
+25oC
2
31
ns
10, 11
+125oC, -55oC
2
40
ns
Enable to Output
TPZL
VCC = 4.5V
9
+25oC
2
27
ns
10, 11
+125oC, -55oC
2
33
ns
TPZH
VCC = 4.5V
9
+25oC
2
24
ns
10, 11
+125oC, -55oC
2
29
ns
Disable to Output
TPLZ
VCC = 4.5V
9
+25oC
2
25
ns
10, 11
+125oC, -55oC
2
29
ns
TPHZ
VCC = 4.5V
9
+25oC
2
21
ns
10, 11
+125oC, -55oC
2
25
ns
NOTES:
1. All voltages referenced to device GND.
2. AC measurements assume RL = 500
, CL = 50pF, Input TR = TF = 3ns, VIL = GND, VIH = VCC.
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
SYMBOL
CONDITIONS
NOTES
TEMPERATURE
LIMITS
UNITS
MIN
MAX
Capacitance Power
Dissipation
CPD
VCC = 5.0V, f = 1MHz
1
+25oC
-
30
pF
1
+125oC, -55oC
-
60
pF
Input Capacitance
CIN
VCC = 5.0V, f = 1MHz
1
+25oC
-
10
pF
1
+125oC, -55oC
-
10
pF
Output Transition
Time
TTHL
TTLH
VCC = 4.5V
1
+25oC
-
12
ns
1
+125oC, -55oC
-
18
ns
Setup Time Data to
LE
TSU
VCC = 4.5V
1
+25oC10
-
ns
1
+125oC, -55oC15
-
ns
Hold Time Data to
LE
TH
VCC = 4.5V
1
+25oC8
-
ns
1
+125oC, -55oC12
-
ns
Pulse Width LE
TW
VCC = 4.5V
1
+25oC16
-
ns
1
+125oC, -55oC24
-
ns
NOTE:
1. The parameters listed in Table 3 are controlled via design or process parameters. Min and Max Limits are guaranteed but not directly
tested. These parameters are characterized upon initial design release and upon design changes which affect these characteristics.



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