F 0118G

2003-04-10

3

Mechanische Werte

Mechanical values

Bezeichnung

Parameter

Symbol

Symbol

Wert

Value

1)

Einheit

Unit

min.

typ.

max.

Chipkantenlänge (x-Richtung)

Length of chip edge (x-direction)

L

x

0.28

0.30

0.32

mm

Chipkantenlänge (y-Richtung)

Length of chip edge (y-direction)

L

y

0.28

0.30

0.32

mm

Durchmesser des Wafers

Diameter of the wafer

D

76.2

mm

Chiphöhe

Die height

H

165

185

205

µm

Bondpaddurchmesser

Diameter of bondpad

d

135

µm

Weitere Informationen

Additional information

2)

Vorderseitenmetallisierung

Metallization frontside

Aluminium

Aluminum

Rückseitenmetallisierung

Metallization backside

Goldlegierung

Gold alloy

Trennverfahren

Dicing

Sägen

Sawing

Verbindung Chip - Träger

Die bonding

Kleben

Epoxy bonding

1)

Typical (refered to as typ.) data are defined as long-term production mean values and are only given for information.

This is not a specified value

2)

All chips are checked according to the following procedure and the OSRAM OS specification of the visual inspection

A63501-Q0013-N001-*-76G3:

The visual inspection shall be made in accordance to the "specification of the visual inspection" as referenced.The

visual inspection of chip backside is performed by eye for 100% of the area of each wafer. If decisions (good/bad) are

not possible additional a stereo microscope with incident light with 40x-80x magnification is used. Areas greater than

¼ cm² which have an amount of more than 3% failed dies will be marked manually with pen. The marked area from

backside will be transfered to frontside and will be also marked manually with pen. The visual inspection of chip

frontside is performed by a stereo microscope with incident light with 40x-80x magnification for 100% of the area of

each wafer. Areas greater than 1 cm² which have an amount of more than 50% failed dies and areas greater than 2

cm² which have an amount of more than 25% failed dies will be marked. The quality inspection (final visual inspection)

is performed by production. An additional visual inspection step as special release procedure by QM after the final

visual inspection is not installed.