ADIS16006SLASHPCB datasheet(14/16 Pages) AD

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ADIS16006

Rev. 0 | Page 14 of 16

APPLICATIONS

SECOND LEVEL ASSEMBLY

The ADIS16006 can be attached to the second-level assembly

board using SN63 (or equivalent) or lead-free solder. Figure 24

and Table 11 provide acceptable solder reflow profiles for each

solder type. Note that these profiles cannot be the optimum

profile for the user’s application. In no case shall 260°C be

exceeded. It is recommended that the user develop a reflow

profile based upon the specific application. In general, keep

in mind the lowest peak temperature and shortest dwell time

above the melt temperature of the solder result in less shock

and stress to the product. In addition, evaluating the cooling

rate and peak temperature can result in a more reliable assembly.

t25°C TO PEAK

PREHEAT

CRITICAL ZONE

TL TO TP

TIME

RAMP-DOWN

RAMP-UP

TSMIN

TSMAX

Figure 24. Acceptable Solder Reflow Profiles

Table 11.

Condition

Profile Feature

Sn63/Pb37

Pb-free

Average Ramp Rate (TL to TP)

3°C/sec max

Preheat

Minimum Temperature (TSMIN)

100°C

150°C

Maximum Temperature (TSMAX)

150°C

200°C

Time (TSMIN to TSMAX) (ts)

60 sec to

120 sec

60 sec to

150 sec

TSMAX to TL

Ramp-Up Rate

3°C/sec

Time Maintained

Above Liquidous (TL)

Liquidous Temperature (TL)

183°C

217°C

Time (tL)

60 sec to

150 sec

60 sec to

150 sec

Peak Temperature (TP)

240°C +

0°C/−5°C

260°C +

0°C/−5°C

Time Within 5°C of Actual Peak

Temperature (tp)

10 sec to

30 sec

20 sec to

40 sec

Ramp-Down Rate

6°C/sec max

Time 25°C to Peak Temperature

6 min max

8 min max

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