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AS1322B Arkusz danych(PDF) 14 Page - ams AG |
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AS1322B Arkusz danych(HTML) 14 Page - ams AG |
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14 / 17 page ![]() www.austriamicrosystems.com Revision 1.03 14 - 17 AS1322 austriamicrosystems Data Sheet 10 Package Drawings and Markings The device is available in a 6-pin TSOT-23 package. Figure 22. 6-pin TSOT-23 Package Notes: 1. Dimensioning and tolerancing conform to ASME Y14.5M - 1994. 2. Dimensions are in millimeters. 3. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall not exceed 0.15mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protru- sion shall not exceed 0.15mm per side. Dimensions D and E1 are determined at datum H. 4. The package top can be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but include any mistmatches between the top of the package body and the bottom. D and E1 are determined at datum H. 5. Datums A and B are to be determined at datum H. 6 7 3 4 3 4 A A |
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