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CP30H Arkusz danych(PDF) 2 Page - CUI Devices |
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CP30H Arkusz danych(HTML) 2 Page - CUI Devices |
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2 / 9 page ![]() CUI DEVICES | SERIES: CP30H | DESCRIPTION: PELTIER MODULE date 08/05/2022 | page 2 of 9 cuidevices.com COLD SIDE HOT SIDE 0.05 0.05 THICKNESS COLD SIDE Black (-) Red (+) WIDTH LENGTH 100.0 5.0 10.0 3.0 SPECIFICATIONS parameter conditions/description min typ max units solder melting temperature connection between thermoelectric pairs 235 °C assembly compression 1 MPa RoHS yes MECHANICAL DRAWING units: mm MATERIAL PLATING ceramic plate 96% AL 2O3 wire leads (CP30444) 20 AWG tin wire leads (all other models) 22 AWG tin sealer silicon rubber 703 RTV (between cold and hot side plates) joint cover silicon rubber 703 RTV marking P/N & S/N printed on cold side surface MODEL NO. LENGTH (mm) WIDTH (mm) THICKNESS (mm) CP30138H 15 ±0.3 15 ±0.3 3.8 ±0.025 CP30238H 20 ±0.3 20 ±0.3 3.8 ±0.025 CP30239H 20 ±0.3 20 ±0.3 3.9 ±0.1 CP30301538H 30 ±0.3 15 ±0.3 3.8 ±0.025 CP303385H 30 ±0.3 30 ±0.3 3.85 ±0.02 CP30444 40 ±0.3 40 ±0.3 4.4 ±0.1 Additional Resources: Product Page | 3D Model |
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