I Figure 1 CXA2701GA Block Diagram

I Figure 2 CXA2702GA Block Diagram

(Items in parentheses apply to the CXA2716GA.)

I Figure 3 CXA2701GA Pin Configuration

I Figure 4 CXA2702GA Pin Configuration

(Items in parentheses apply to the CXA2716GA.)

I Figure 7 CXA2716GA Acceptance Pattern Dimensions

I Figure 5 CXA2701GA Acceptance Pattern Dimensions

I Figure 6 CXA2702GA Acceptance Pattern Dimensions

I Figure 8 Recommended Reflow Soldering Temperature

Profile (Lead-free soldering)

Vout+

Vcc

Vc

GND

Low

740

Ω

1 k

Ω

1 k

Ω

200

Ω

200

Ω

50 k

Ω

50 k

Ω

High

High

Photodiode

SW

Vin1

Vin2

IVout

VR2

VR1

4

11

Vc_MONI 12

1

9

6

10

5

8

GND

2

×1.8

×1

Vout–

7

Low

–

+

–

+

–

+

1

10

5

4

14

17

12

7

Vcc

Vc

GND

VLIMIT

RF+

A

Vc

B

C

D

RF–

WPP1

WPP2

3

2

SWA

SWB

6

×3

A

A

Vc

A'

–

+

–

+

–

+

–

+

–

+

–

+

–

+

–

+

–

+

–

+

–

+

–

+

8

B

×3

B

Vc

B'

13

C

×3

C

Vc

C'

11

D

×3

D

Vc

D'

9

E

(EF2)

×3

E

(E2+F2)

Vc

18

F

(EF1)

×3

F

(E1+F1)

Vc

16

G

(EF3)

×3

G

(E3+F3)

Vc

15

H

(EF4)

×3

H

(E4+F4)

Vc

A

B

C

D

B'

Vc

Vcc

Vc

C'

A'

Vc

D'

9

10

11

12

IVout

Vout–

SW

Vout+

Vin2

Vin1

Vc

Vc_MONI

GND GND

NC

Vcc

1

2

3

5

6

7

8

4

14

15

16

17

18

RF+

D

A

WPP1

WPP2

C

B

H

(EF4)

G

(EF3) RF–

F

(EF1)

Vcc SWB SWA VLIMIT GND

1

2

3

4

6

7

8

E

(EF2)

9

11

Vc

10

12

13

5

φ 0.7 mm

Photosensitive area position:

At the package center

180

°C

150

°C

2 to 4

°C/s

(3 to 6

°C/s)

2 to 6

°C/s

Peak: 250

°C Max.

230

°C or more

Pre Heating Zone

90

± 30 s

30

± 10 s

Soldering Zone

Heating time

250

200

150

100

50

[

°C]

Note: The temperatures shown are package surface temperatures.

120

120

D

120

35

35

C

A

B

E4

E3

E1

E2

F4

F3

F1

F2

Unit:

µm

H

120

G

F

120

E

D

120

35

35

C

A

B

Unit:

µm