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AT24CS32 Arkusz danych(PDF) 33 Page - Microchip Technology

Numer części AT24CS32
Szczegółowy opis  I²C-Compatible (Two-Wire) Serial EEPROM with a Unique,Factory-Programmed 128-Bit Serial Number 32‑Kbit (4,096 x 8)
PDF  42 Pages
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Producent  MICROCHIP [Microchip Technology]
Strona internetowa  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

AT24CS32 Arkusz danych(HTML) 33 Page - Microchip Technology

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© 2018 Microchip Technology Incorporated
RECOMMENDED LAND PATTERN
Dimension Limits
Units
Optional Center Pad Width
Optional Center Pad Length
Contact Pitch
Y2
X2
1.40
1.60
MILLIMETERS
0.50 BSC
MIN
E
MAX
Contact Pad Length (X8)
Contact Pad Width (X8)
Y1
X1
0.85
0.30
NOM
12
8
C
Contact Pad Spacing
2.90
Contact Pad to Center Pad (X8)
G1
0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Microchip Technology Drawing C04-21355-Q4B Rev A
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]
Atmel Legacy YNZ Package
X2
Y2
Y1
SILK SCREEN
X1
E
C
EV
G2
G1
ØV
Contact Pad to Contact Pad (X6)
G2
0.33
AT24CS32
Packaging Information
© 2020 Microchip Technology Inc.
Datasheet
DS20006341A-page 33



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