| Zakładka z wyszukiwarką danych komponentów |
|
MP3383 Arkusz danych(PDF) 5 Page - Monolithic Power Systems |
|
|
|||||||||||||||||||||||||||||
MP3383 Arkusz danych(HTML) 5 Page - Monolithic Power Systems |
|
5 / 23 page ![]() MP3383 – 4-STRING, MAX 80V VOUT, STEP-UP WLED CONTROLLER MP3383 Rev. 1.0 MonolithicPower.com 5 5/2/2022 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2022 MPS. All Rights Reserved. ABSOLUTE MAXIMUM RATINGS (1) VIN .................................................-0.3V to +37V VCC, VGATE......................................-0.3V to +16V VLED1 to VLED4.................................-0.3V to +80V All other pins ................................-0.3V to +6.5V Continuous power dissipation (TA = 25°C) (2) TSSOP-16EP........................................... 2.78W SOIC-16 ................................................... 1.56W Junction temperature ................................150°C Lead temperature .....................................260°C Storage temperature ................ -60°C to +150°C ESD Ratings Human body model (HBM) ........................ ±2kV Charged device model (CDM) ................. ±750V Recommended Operating Conditions (3) Supply voltage (VIN) ............................6V to 33V Max LED current ................................. 400mA (5) Operating junction temp........... -40°C to +125°C Thermal Resistance (4) θJA θJC TSSOP-16EP .........................45 ...... 10 ... °C/W SOIC-16…………………………..80 ……35....°C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ (MAX), the junction-to- ambient thermal resistance, θ JA, and the ambient temperature, TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX) - TA) / θJA. Exceeding the maximum allowable power dissipation can produce an excessive die temperature, which may cause the regulator to go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, a 4-layer PCB. 5) Not tested in production. Guaranteed by characterization. |
|
|
Link URL |
| Czy Alldatasheet okazała się pomocna? [ DONATE ] |
O Alldatasheet | Reklama | Kontakt | Polityka prywatności | Link do karty katalogowej | Linki | Lista producentów All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |