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QUALITY & RELIABILITY

Accu-P® is based on well established thin-film technology and materials.

• ON-LINE PROCESS CONTROL

This program forms an integral part of the production cycle and acts

as a feedback system to regulate and control production processes.

The test procedures, which are integrated into the production process,

were developed after long research work and are based on the highly

developed semiconductor industry test procedures and equipment.

These measures help KYOCERA AVX to produce a con- sistent and high

yield line of products.

• FINAL QUALITY INSPECTION

Finished parts are tested for standard electrical parameters and visual/

mechanical characteristics. Each production lot is 100% evaluated

for: capacitance and proof voltage at 2.5 UR. In addition, production is

periodically evaluated for:

Average capacitance with histogram printout for capacitance

distribution;

IR and Breakdown Voltage distribution;

Temperature Coefficient;

Solderability;

Dimensional, mechanical and temperature stability.

QUALITY ASSURANCE

The reliability of these thin-film chip capacitors has been studied

intensively for several years. Various measures have been taken

to obtain the high reliability required today by the industry. Quality

assurance policy is based on well established international industry

standards. The reliability of the capacitors is determined by accelerated

testing under the following conditions:

Life (Endurance)

125°C, 2UR, 1000 hours

Accelerated Damp

Heat Steady State

85°C, 85% RH, UR, 1000 hours.

ENVIRONMENTAL CHARACTERISTICS

MECHANICAL CHARACTERISTICS

TEST

CONDITIONS

REQUIREMENT

Life (Endurance)

MIL-STD-202F Method 108A

125°C, 2UR,1000 hours

No visible damage

Δ C/C ≤ 2% for C≥5pF

Δ C ≤ 0.25pF for C<5pF

Accelerated Damp

Heat Steady State

MIL-STD-202F Method 103B

85°C, 85% RH, UR, 1000 hours

No visible damage

Δ C/C ≤ 2% for C≥5pF

Δ C ≤ 0.25pF for C<5pF

Temperature Cycling

MIL-STD-202F Method 107E

MIL-STD-883D Method 1010.7

-55°C to +125°C, 15 cycles – Accu-P®

No visible damage

Δ C/C ≤ 2% for C≥5pF

Δ C ≤ 0.25pF for C<5pF

Resistance to Solder Heat

IEC-68-2-58

260°C ± 5°C for 10 secs

C remains within initial limits

TEST

CONDITIONS

REQUIREMENT

Solderability

IEC-68-2-58

Components completely immersed in a solder bath at 235°C for

2 secs.

Terminations to be well tinned, minimum 95% coverage

Leach Resistance

IEC-68-2-58

Components completely immersed in a solder bath at 260±5°C for

60 secs.

Dissolution of termination faces ≤15% of area

Dissolution of termination edges ≤25% of length

Adhesion

MIL-STD-202F Method 211A

A force of 5N applied for 10 secs.

No visible damage

Termination Bond Strength

IEC-68-2-21 Amend. 2

Tested as shown in diagram

D = 3mm Accu-P

D = 1mm Accu-F

No visible damage

Δ C/C ≤ 2% for C≥5pF

Δ C ≤ 0.25pF for C<5pF

Robustness of Termination

IEC-68-2-21 Amend. 2

A force of 5N applied for 10 secs.

No visible damage

High Frequency Vibration

MIL-STD-202F Method 201A,

204D (Accu-P® only)

55Hz to 2000Hz, 20G

No visible damage

Storage

12 months minimum with components stored in “as

received” packaging

Good solderability

012419

Thin-Film RF/Microwave Capacitor Technology

Environmental / Mechanical Characteristics

Accu-P® Series

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or

available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.