BYV26F datasheet(4/12 Pages) PHILIPS

Numer części	BYV26F

Szczegółowy opis	Fast soft-recovery controlled avalanche rectifiers

PDF	12 Pages

Scroll/Zoom	100%

Producent	PHILIPS [NXP Semiconductors]

Strona internetowa	http://www.nxp.com

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4 / 12 page

1996 May 30

Philips Semiconductors

Product speciﬁcation

Fast soft-recovery

controlled avalanche rectiﬁers

BYV26 series

THERMAL CHARACTERISTICS

Note

1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer

≥40 µm, see Fig.19.

For more information please refer to the

“General Part of associated Handbook”.

maximum slope of reverse recovery

current

when switched from

IF = 1 A to VR ≥ 30 V and

dIF/dt = −1A/µs;

see Fig.21

BYV26A to C

−−

7A/

µs

BYV26D and E

−−

6A/

µs

BYV26F and G

−−

5A/

µs

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

Rth j-tp

thermal resistance from junction to tie-point

lead length = 10 mm

K/W

Rth j-a

thermal resistance from junction to ambient

note 1

100

K/W

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

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