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TPS25751D Arkusz danych(PDF) 80 Page - Texas Instruments |
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TPS25751D Arkusz danych(HTML) 80 Page - Texas Instruments |
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80 / 89 page ![]() www.ti.com PACKAGE OUTLINE C 38X 0.45 0.25 0.8 0.7 (0.2) TYP 0.05 0.00 30X 0.4 2 2X 4.8 1.63 1.43 2X 2.75 2.55 2.82 2.62 38X 0.25 0.15 2.2 4X 0.45 4X (0.2) 0.45 0.25 0.25 0.15 0.965 1.56 A 6.1 5.9 B 4.1 3.9 WQFN - 0.8 mm max height REF0038A PLASTIC QUAD FLATPACK - NO LEAD 4226763/C 11/2021 PIN 1 INDEX AREA 0.08 C SEATING PLANE 1 6 20 7 25 19 38 26 X 0.3) (45 PIN 1 ID 0.07 C A B 0.05 EXPOSED THERMAL PAD 39 SYMM PKG 40 SEE DETAIL A NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pads must be soldered to the printed circuit board for optimal thermal and mechanical performance. DETAIL A TYPICAL SCALE 2.800 TPS25751 SLVSH93 – OCTOBER 2023 www.ti.com 80 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TPS25751 |
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