52

Am29DL640H

June 7, 2005

REVISION SUMMARY

Revision A (November 11, 2002)

Initial release.

Revision A+1 (August 29, 2003)

Am29DL640H

Converted to preliminary datasheet.

Distinctive Characteristics and Physical

Dimensions

Removed 48-ball fine pitch BGA and 64-ball fortified

BGA.

Added 63-ball fine pitch BGA.

Ordering Information

Changed package type from WC to WH and removed

PC package.

Table 6, Am29DL640H Boot Sector/Sector Block

Addresses for Protection/Unprotection

Modified the SA140 address.

Revision A+2 (October 24, 2003)

Table 11, Primary Vendor-Specific Extended Query

Corrected definitions for data at address 4Fh.

Revision A+3 (November 26, 2003)

DC Characteristics table

Changed VOL maximum specification from 4 mA to 2

mA.

Revision A+4 (May 10, 2004)

Updated preliminary to datasheet status.

Added additional header information on first page of

datasheet.

Revision A+5 (July 12, 2004)

Table 5, “Am29DL640H Autoselect Codes, (High

Voltage Method),” on page 14.

Replaced “80h (factory locked),40h (customer locked),

00h (not factory/customer locked)” with “81h (factory

locked),01h (customer and factory locked)”.

Table 12, “Am29DL640H Command Definitions,” on

page 27

In Secured Silicon Sector Factory Protect row, Data

column - Replaced “80/00” with “81/01”.

(Note 10) Replaced “The data is 80h for factory

locked, 40h for customer locked, and 00h for not fac-

tory/customer locked” with “The data is 81h for factory

locked, 40h for customer locked, and 01h for not fac-

tory/customer locked”.

Revision A+6 (February 9, 2005)

Connection Diagrams

Updated the 63-ball FBGA diagram.

Revision A+7 (June 7, 2005)

Cover page and Title page

Updated EOL disclaimers.

Added notation to superseding documents.

Colophon

The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-

tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-

templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the

public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,

aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for

any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to

you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor de-

vices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design mea-

sures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating

conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign

Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-

thorization by the respective government entity will be required for export of those products

Trademarks

Copyright ©2002-2005 Advanced Micro Devices, Inc. All rights reserved.

AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.

ExpressFlash is a trademark of Advanced Micro Devices, Inc.

Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.