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P2000DM Arkusz danych(PDF) 4 Page - UN Semiconducctor INC |
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P2000DM Arkusz danych(HTML) 4 Page - UN Semiconducctor INC |
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4 / 6 page ![]() Revision March 1,2022 www.unsemi.com.tw For technical questions, contact: tech@unsemi.com.tw ROHS Thyristor Surge Suppressors (TSS) Specifications are subject to change without notice. Please refer to www.unsemi.com.tw for current information. 4/5 Soldering Parameters ROHS Environmental Specifications Physical Specifications Lead Material Terminal Finish Body Material Copper Alloy 100% Matte-Tin Plated UL recognized epoxy meeting flammability classification 94V-0 High Temp Voltage Blocking 80% Rated VDRM (VAC Peak ) +125°C or +150°C, Lead Material Copper Alloy High Temp Voltage Blocking 504 or 1008 hrs. MIL-STD-750 (Method 1040) JEDEC, JESD22-A-101 -65°C to +150°C, 15 min. dwell, 10 up to 100 cycles.MIL-STD-750 (Method 1051) EIA/JEDEC, JESD22-A104 52 VDC (+85°C) 85%RH, 504 up to 1008 hrs. EIA/ JEDEC, JESD22-A-101 +150°C 1008 hrs. MIL-STD-750 (Method 1031) JEDEC, JESD22-A-101 85%RH, +85°C, 168 hrs., 3 reflow cycles Level (+260°C Peak). JEDEC-J-STD-020, Level 1 -65°C, 1008 hrs. 0°C to +100°C, 5 min. dwell, 10 sec. transfer, Thermal Shock 10 cycles. MIL-STD-750 (Method 1056) JEDEC, JESD22-A-106 +121°C, 100%RH, 2atm, 24 up to 168 hrs. EIA/Cooker Test) JEDEC, JESD22-A-102 +260°C, 30 secs. MIL-STD-750 (Method 2031 Biased Temp & Humidity High Temp Storage Low Temp Storage Thermal Shock Autoclave (Pressure Cooker Test) Resistance to Solder Heat Moisture Sensitivity Level Temp Cycing @10/700μS,2KV PXXXXDM Series SOD-123FL(SMF) Time Time to peak temperature ( T25℃ to peak) Preheat Ts(min) Ts(max) TL TL TP Ramp-up Ramp-down Critical Zone TL toTP TP Ts Lead–free assembly +150°C +200°C 60 -180 Seconds 3°C/Second max 5°C/Second max 217°C 60 -150 Seconds 260 +0/-5°C 30 Seconds Max 6°C/Second Max 8 minutes Max +260°C Reflow Condition Pre Heat -Temperature Min (Ts(min)) -Temperature Max (Ts(max)) - Time (min to max) (TS) Average ramp up rate ( Liquidus Temp TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Time (min to max) (TS) Peak Temperature (TP) Do not exceed Time 25°C to peak Temperature (TP) Time within 5°C of actual peak Temperature (TP) Ramp-down Rate |
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