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P2000DM Arkusz danych(PDF) 4 Page - UN Semiconducctor INC

Numer części P2000DM
Szczegółowy opis  Thyristor Surge Suppressors (TSS)
PDF  6 Pages
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Producent  UNSEMI [UN Semiconducctor INC]
Strona internetowa  http://www.unsemi.com.tw
Logo UNSEMI - UN Semiconducctor INC

P2000DM Arkusz danych(HTML) 4 Page - UN Semiconducctor INC

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Revision March 1,2022
www.unsemi.com.tw
For technical questions, contact: tech@unsemi.com.tw
ROHS
Thyristor Surge Suppressors (TSS)
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
4/5
Soldering Parameters
ROHS
Environmental Specifications
Physical Specifications
Lead Material
Terminal Finish
Body Material
Copper Alloy
100% Matte-Tin Plated
UL recognized epoxy meeting flammability
classification 94V-0
High Temp
Voltage Blocking
80% Rated VDRM (VAC Peak ) +125°C or
+150°C, Lead Material Copper Alloy High Temp
Voltage Blocking 504 or 1008 hrs. MIL-STD-750
(Method 1040) JEDEC, JESD22-A-101
-65°C to +150°C, 15 min. dwell, 10 up to 100
cycles.MIL-STD-750 (Method 1051) EIA/JEDEC,
JESD22-A104
52 VDC (+85°C) 85%RH, 504 up to 1008 hrs.
EIA/ JEDEC, JESD22-A-101
+150°C 1008 hrs. MIL-STD-750 (Method 1031)
JEDEC, JESD22-A-101
85%RH, +85°C, 168 hrs., 3 reflow cycles Level
(+260°C Peak). JEDEC-J-STD-020, Level 1
-65°C, 1008 hrs.
0°C to +100°C, 5 min. dwell, 10 sec. transfer,
Thermal Shock 10 cycles. MIL-STD-750
(Method 1056) JEDEC, JESD22-A-106
+121°C, 100%RH, 2atm, 24 up to 168 hrs.
EIA/Cooker Test) JEDEC, JESD22-A-102
+260°C, 30 secs. MIL-STD-750 (Method 2031
Biased Temp &
Humidity
High Temp Storage
Low Temp Storage
Thermal Shock
Autoclave (Pressure
Cooker Test)
Resistance to Solder
Heat
Moisture Sensitivity
Level
Temp Cycing
@10/700μS,2KV
PXXXXDM Series SOD-123FL(SMF)
Time
Time to peak temperature
( T25℃ to peak)
Preheat
Ts(min)
Ts(max)
TL
TL
TP
Ramp-up
Ramp-down
Critical Zone
TL toTP
TP
Ts
Lead–free assembly
+150°C
+200°C
60 -180 Seconds
3°C/Second max
5°C/Second max
217°C
60 -150 Seconds
260 +0/-5°C
30 Seconds Max
6°C/Second Max
8 minutes Max
+260°C
Reflow Condition
Pre Heat
-Temperature Min (Ts(min))
-Temperature Max (Ts(max))
- Time (min to max) (TS)
Average ramp up rate ( Liquidus
Temp TL) to peak
TS(max) to TL - Ramp-up Rate
Reflow
- Temperature (TL) (Liquidus)
- Time (min to max) (TS)
Peak Temperature (TP)
Do not exceed
Time 25°C to peak Temperature (TP)
Time within 5°C of actual peak
Temperature (TP)
Ramp-down Rate



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