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TCS34713FN Arkusz danych(PDF) 33 Page - OSRAM GmbH |
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TCS34713FN Arkusz danych(HTML) 33 Page - OSRAM GmbH |
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33 / 39 page ![]() Page 32 ams Datasheet Document Feedback [v1-01] 2018-Mar-27 TCS3471 − Manufacturing Information Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previously absorbed into the package. To ensure the package contains the smallest amount of absorbed moisture possible, each device is dry-baked prior to being packed for shipping. Devices are packed in a sealed aluminized envelope with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. The FN package has been assigned a moisture sensitivity level of MSL 3 and the devices should be stored under the following conditions: • Temperature Range: 5ºC to 50ºC • Relative Humidity: 60% maximum • Total Time: 12 months from the date code on the aluminized envelope — if unopened • Opened Time: 168 hours or fewer Rebaking will be required if the devices have been stored unopened for more than 12 months or if the aluminized envelope has been open for more than 168 hours. If rebaking is required, it should be done at 50ºC for 12 hours. |
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