ams Datasheet

Page 29

[v1-01] 2018-Mar-27

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TCS3471 − Mechanical Data

Figure 36:

Package FN — Dual Flat No-Lead Packaging Configuration

Note(s):

1. All linear dimensions are in micrometers.

2. The die is centered within the package within a tolerance of ± 75

μm.

3. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.

4. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.

5. This package contains no lead (Pb).

6. This drawing is subject to change without notice.

Mechanical Data

PACKAGE FN

Dual Flat No-Lead

650

BSC

203

+ 8

TOP VIEW

SIDE VIEW

BOTTOM VIEW

Lead Free

Pb

300

+ 50

2000

+ 75

2400

+ 75

PIN 1

PIN 1

END VIEW

650

+ 50

PIN OUT

TOP VIEW

750

+ 100

295

Nominal

406

+ 10

CL of Solder Contacts and

Photodiode Array Area (Note B)

CL of Solder Contacts

of Photodiode Array Area (Note B)

CL

125 Nominal

6 SDA

5 INT

4 NC

VDD 1

SCL 2

GND 3

496

+ 10

Photodiode Active Area

Green

RoHS

2

2