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Zakładka z wyszukiwarką danych komponentów |
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Zakładka z wyszukiwarką danych komponentów |
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TMF8801 Arkusz danych(PDF) 68 Page - OSRAM GmbH |
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TMF8801 Arkusz danych(HTML) 68 Page - OSRAM GmbH |
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68 / 73 page  Document Feedback TMF8801 Soldering & Storage Information Datasheet • PUBLIC DS000648 • v10-00 • 2022-Dec-20 72 │ 67 12 Soldering & Storage Information 12.1 Soldering Information The package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure 126: Solder Reflow Profile Graph Figure 127: Solder Reflow Profile Parameter Reference Device Average temperature gradient in preheating 2.5 °C/s Soak time tsoak 2 to 3 minutes Time above 217 °C (T1) t1 Max 90 s |
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