Philips Semiconductors

Product specification

TrenchMOS

™ transistor

PHT6N06LT

Logic level FET

MECHANICAL DATA

Dimensions in mm

Net Mass: 0.11 g

Fig.18. SOT223 surface mounting package.

Notes

1. Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent

damage to MOS gate oxide.

2. Refer to surface mounting instructions for SOT223 envelope.

3. Epoxy meets UL94 V0 at 1/8".

6.7

6.3

3.1

2.9

4

1

23

2.3

1.05

0.85

0.80

0.60

4.6

3.7

3.3

7.3

6.7

B

A

0.10

0.02

13

16

max

1.8

max

10

max

0.32

0.24

(4x)

B

M

0.1

A

M

0.2

January 1998

8

Rev 1.100