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PHT6N06 Arkusz danych(PDF) 2 Page - NXP Semiconductors |
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PHT6N06 Arkusz danych(HTML) 2 Page - NXP Semiconductors |
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2 / 10 page ![]() Philips Semiconductors Product specification TrenchMOS ™ transistor PHT6N06T Standard level FET THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT R th j-sp From junction to solder point Mounted on any PCB 12 15 K/W R th j-amb From junction to ambient Mounted on PCB of Fig.19 - 70 K/W STATIC CHARACTERISTICS T j= 25˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V (BR)DSS Drain-source breakdown V GS = 0 V; ID = 0.25 mA 55 - - V voltage T j = -55˚C 50 - - V V GS(TO) Gate threshold voltage V DS = VGS; ID = 1 mA 2.0 3.0 4.0 V T j = 150˚C 1.2 - - V T j = -55˚C - - 4.4 V I DSS Zero gate voltage drain current V DS = 55 V; VGS = 0 V; - 0.05 10 µA T j = 150˚C - - 100 µA I GSS Gate source leakage current V GS = ±10 V - 0.04 1 µA T j = 150˚C - - 10 µA ±V (BR)GSS Gate source breakdown voltage I G = ±1 mA 16 - - V R DS(ON) Drain-source on-state V GS = 10 V; ID = 5 A - 120 150 m Ω resistance T j = 150˚C - - 277 m Ω DYNAMIC CHARACTERISTICS T mb = 25˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT g fs Forward transconductance V DS = 25 V; ID = 5 A; Tj = 25˚C 0.5 2.5 - S Q g(tot) Total gate charge I D = 5 A; VDD = 44 V; VGS = 10 V - 6 - nC Q gs Gate-source charge - 1.5 - nC Q gd Gate-drain (Miller) charge - 4 - nC C iss Input capacitance V GS = 0 V; VDS = 25 V; f = 1 MHz - 190 240 pF C oss Output capacitance - 65 80 pF C rss Feedback capacitance - 32 45 pF t d on Turn-on delay time V DD = 30 V; ID = 5 A; - 9 14 ns t r Turn-on rise time V GS = 10 V; RG = 10 Ω; - 28 42 ns t d off Turn-off delay time - 15 23 ns t f Turn-off fall time T j = 25˚C - 8 12 ns REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS T j = -55 to 175˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT I DR Continuous reverse drain T sp = 25˚C - - 5.5 A current I DRM Pulsed reverse drain current T sp = 25˚C - - 30 A V SD Diode forward voltage I F = 2 A; VGS = 0 V - 0.85 1.1 V t rr Reverse recovery time I F = 2 A; -dIF/dt = 100 A/µs; - 43 - ns Q rr Reverse recovery charge V GS = -10 V; VR = 30 V - 0.16 - µC September 1997 2 Rev 1.000 |
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