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MPC860EN Arkusz danych(PDF) 75 Page - Freescale Semiconductor, Inc |
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MPC860EN Arkusz danych(HTML) 75 Page - Freescale Semiconductor, Inc |
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75 / 80 page ![]() MPC860 Family Hardware Specifications, Rev. 7 Freescale Semiconductor 75 Mechanical Data and Ordering Information Figure 76. Mechanical Dimensions and Bottom Surface Nomenclature of the ZP PBGA Package Figure 77 shows the mechanical dimensions of the ZQ PBGA package. W V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 SIDE VIEW BOTTOM VIEW 18X 4X 357X b TOP VIEW A2 A3 e 0.3 M C D A A1 D2 0.15 M C E E2 0.2 C A B 0.2 D1 E1 AB 0.25 C 0.35 C C NOTE 1. Dimensions and tolerance per ASME Y14.5M, 1994 2. Dimensions in millimeters 3. Dimension b is the maximum solder ball diameter DIM MIN MAX MILLIMETERS A --- 2.05 0.50 0.70 A2 0.95 1.35 A3 0.70 0.90 b 0.60 0.90 D 25.00 BSC D1 22.86 BSC D2 22.40 22.60 e 1.27 BSC E 25.00 BSC E1 22.86 BSC E2 22.40 22.60 A1 |
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