MPC8540 datasheet(87/104 Pages) FREESCALE

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MPC8540 Arkusz danych(PDF) 87 Page - Freescale Semiconductor, Inc

Numer części	MPC8540

Szczegółowy opis	Integrated Processor Hardware Specifications

PDF	104 Pages

Scroll/Zoom	100%

Producent	FREESCALE [Freescale Semiconductor, Inc]

Strona internetowa	http://www.freescale.com

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87 / 104 page

MPC8540 Integrated Processor Hardware Specifications, Rev. 4

Freescale Semiconductor

Thermal

The spring mounting should be designed to apply the force only directly above the die. By localizing the

force, rocking of the heat sink is minimized. One suggested mounting method attaches a plastic fence to

the board to provide the structure on which the heat sink spring clips. The plastic fence also provides the

opportunity to minimize the holes in the printed-circuit board and to locate them at the corners of the

package. Figure 49 and Figure 50 provide exploded views of the plastic fence, heat sink, and spring clip.

Figure 49. Exploded Views (1) of a Heat Sink Attachment using a Plastic Force

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