MPC8280CVRP datasheet(59/80 Pages) FREESCALE

Numer części	MPC8280CVRP

Szczegółowy opis	PowerQUICC II??Family Hardware Specifications

PDF	80 Pages

Scroll/Zoom	100%

Producent	FREESCALE [Freescale Semiconductor, Inc]

Strona internetowa	http://www.freescale.com

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59 / 80 page

MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7

Freescale Semiconductor

Pinout

Figure 16 shows the side profile of the PBGA package to indicate the direction of the top surface view.

Figure 16. Side View of the PBGA Package Remove

NOTE: Temperature Reflow for the VR Package

In the VR package, sphere composition is lead-free (refer to Table 2). This requires

higher temperature reflow than what is required for other PowerQUICC II

packages. Users should consult “Freescale PowerQUICC II™ Pb-Free Packaging

Information” (MPC8250PBFREEPKG) available at www.freescale.com.

Table 23 shows the pinout list of the MPC8275 and MPC8270. Table 22 defines conventions and acronyms used in

Table 23.

Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List

Pin Name

Ball

MPC8275/MPC8270

MPC8275 only

C16

ABB/IRQ2

A10

Die

Transfer molding compound

1 mm pitch

Wire bonds

attach

DIE

Ball bond

Screen-printed

solder mask

Cu substrate traces

BT resin glass epoxy

Plated substrate via

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