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Zakładka z wyszukiwarką danych komponentów |
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Zakładka z wyszukiwarką danych komponentów |
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LAN8804/ZMXC1 Arkusz danych(PDF) 83 Page - Microchip Technology |
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LAN8804/ZMXC1 Arkusz danych(HTML) 83 Page - Microchip Technology |
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83 / 91 page  LAN8804 © 2024 Microchip Technology Inc. and its subsidiaries DS00003591G-page 83 FIGURE 7-3: 128-TQFP PACKAGE (LAND PATTERN) RECOMMENDED LAND PATTERN Dimension Limits Units C2 Optional Center Pad Width Contact Pad Spacing Optional Center Pad Length Contact Pitch Y2 X2 9.10 9.10 MILLIMETERS 0.40 BSC MIN E MAX 15.40 Contact Pad Length (X128) Contact Pad Width (X128) Y1 X1 1.50 0.20 NOM C1 Contact Pad Spacing 15.40 Contact Pad to Contact Pad (X124) G2 0.20 Thermal Via Diameter V Thermal Via Pitch EV 0.33 1.20 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. Contact Pad to Center Pad (X128) G1 2.40 Microchip Technology Drawing C04-2502 Rev A C1 C2 E X1 Y1 G1 G2 ØV X2 Y2 EV EV SILK SCREEN 1 2 332 65 96 97 128 33 64 |
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