11

LT1033

1033fc

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

0.580 – 0.6OO

(14.73 – 15.24)

0.170

(4.32)

MAX

0.325

(8.255)

0.580

(14.732)

0.560

(14.224)

0.620 – 0.64O

(15.75 – 16.26)

0.170 – 0.2OO

(4.32 – 5.08)

MOUNTING HOLE

0.115 – 0.145

(2.92 – 3.68)

DIA

0.580 – 0.6OO

(14.73 – 15.24)

0.830 – 0.870

(21.08 – 22.10)

0.780 – 0.800

(19.81 – 20.32)

0.620 – 0.64O

(15.75 – 16.26)

0.215

(5.46)

BSC

0.113 – 0.123

(2.87 – 3.12)

0.042 – 0.052

(1.07 – 1.32)

0.074 – 0.084

(1.88 – 2.13)

0.187 – 0.207

(4.75 – 5.26)

0.060 – 0.080

(1.52 – 2.03)

18

° – 22°

3

° – 7°

0.087 – 0.102

(2.21 – 2.59)

0.020 – 0.040

(0.51 – 1.02)

EJECTOR PIN MARKS

0.105 – 0.125

(2.67 – 3.18)

DIA

P3 0996

0.098

(2.489)

0.124

(3.149)

0.700

(17.780)

0.275

(6.985)

BOTTOM VIEW OF TO-3P

HATCHED AREA IS SOLDER PLATED

COPPER HEAT SINK

P Package

3-Lead Plastic TO-3P (Similar to TO-247)

(Reference LTC DWG # 05-08-1450)