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LTC4215CUFD Arkusz danych(PDF) 23 Page - Linear Technology

Numer części LTC4215CUFD
Szczegółowy opis  Hot Swap Controller with I2C Compatible Monitoring
PDF  24 Pages
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Producent  LINER [Linear Technology]
Strona internetowa  http://www.linear.com
Logo LINER - Linear Technology

LTC4215CUFD Arkusz danych(HTML) 23 Page - Linear Technology

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LTC4215
23
4215fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTIO
UFD Package
24-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1696)
4.00
± 0.10
(2 SIDES)
2.65
± 0.10
(2 SIDES)
5.00
± 0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40
± 0.05
23 24
1
2
BOTTOM VIEW—EXPOSED PAD
3.65
± 0.10
(2 SIDES)
0.75
± 0.05
R = 0.115
TYP
PIN 1 NOTCH
R = 0.30 TYP
0.25
± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UFD24) QFN 0505
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.70
±0.05
0.25
±0.05
0.50 BSC
2.65
± 0.05
(2 SIDES)
3.65
± 0.05
(2 SIDES)
4.10
± 0.05
5.50
± 0.05
3.10
± 0.05
4.50
± 0.05
PACKAGE
OUTLINE
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
GN16 (SSOP) 0204
.016 – .050
(0.406 – 1.270)
0
° – 8° TYP
.007 – .0098
(0.178 – 0.249)
.0532 – .0688
(1.35 – 1.75)
.008 – .012
(0.203 – 0.305)
TYP
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
12
3
4
5
6
7
8
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
16 15 14 13
.189 – .196*
(4.801 – 4.978)
12 11 10 9
.009
(0.229)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 BSC
.0165
±.0015
.045
±.005
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE



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