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STW9N150 Arkusz danych(PDF) 5 Page - STMicroelectronics |
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STW9N150 Arkusz danych(HTML) 5 Page - STMicroelectronics |
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5 / 12 page ![]() STW9N150 Electrical characteristics 5/12 Table 7. Switching times Symbol Parameter Test conditions Min. Typ. Max Unit td(on) tr td(off) tf Turn-on delay time Rise time Turn-off-delay time Fall time VDD = 750 V, ID = 4 A, RG = 4.7 Ω, VGS = 10 V (see Figure 14) 41 14.7 86 52 ns ns ns ns Table 8. Source drain diode Symbol Parameter Test conditions Min. Typ. Max Unit ISD ISDM (1) 1. Pulse width limited by safe operating area Source-drain current Source-drain current (pulsed) 8 32 A A VSD (2) 2. Pulsed: pulse duration = 300 µs, duty cycle 1.5% Forward on voltage ISD = 8 A, VGS = 0 1.6 V trr Qrr IRRM Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 8 A, di/dt = 100 A/µs VDD= 60 V (see Figure 16) 988 9.5 19.3 ns µC A trr Qrr IRRM Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 8 A, di/dt = 100 A/µs VDD= 60 V TJ = 150 °C (see Figure 16) 884 8.2 18.6 ns µC A |
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