MP6604C

– 4.5V TO 45V, 2.5A, SIMPLE DUAL H-BRIDGE DRIVER (HS/LS)

MP6604C Rev. 1.1

MonolithicPower.com

4

5/12/2023

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ABSOLUTE MAXIMUM RATINGS (1)

Supply voltage (VIN) ......................-0.3V to +48V

xOUTx voltage (VAOUT1, VAOUT2, VBOUT1, VBOUT2)...

………………………………………-0.7V to +48V

VCP, CPB .................................VIN to VIN + 6.5V

PGNDx to GND............................-0.3V to +0.3V

All other pins to GND ...................-0.3V to +6.5V

Continuous power dissipation (TA = 25°C) (2)

QFN-28 (4mmx5mm)..

.………………….3.125W

TSSOP-28EP

…..……….…………………...3.9W

Storage temperature ................ -55°C to +150°C

Junction temperature ................................150°C

Lead temperature (solder) ........................260°C

ESD Ratings

Human body model (HBM) .................... ±2000V

Charged device model (CDM) ............... ±2000V

Recommended Operating Conditions (3)

Supply voltage (VIN) .........................4.5V to 45V

PGNDx to GND............................-0.2V to +0.2V

Operating junction temp (TJ) .... -40°C to +125°C

Thermal Resistance (4)

θJA

θJC

QFN-28 (4mmx5mm)...............40

……9.........°C

TSSOP-28EP...........................32.

…...6……..°C

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature, TJ (MAX), the junction-to-

ambient

thermal

resistance,

θ

JA,

and

the

ambient

temperature, TA. The maximum allowable continuous power

dissipation at any ambient temperature is calculated by PD

(MAX) = (TJ (MAX) - TA) / θJA. Exceeding the maximum

allowable power dissipation can produce an excessive die

temperature, which may cause the regulator to go into

thermal

shutdown.

Internal

thermal

shutdown

circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, a 4-layer PCB.