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TC682 Arkusz danych(PDF) 8 Page - Microchip Technology |
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TC682 Arkusz danych(HTML) 8 Page - Microchip Technology |
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8 / 14 page ![]() TC682 DS21453C-page 8 © 2006 Microchip Technology Inc. 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Package marking data not available at this time. 6.2 Taping Form 6.3 Package Dimensions Component Taping Orientation for 8-Pin SOIC (Narrow) Devices Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin SOIC (N) 12 mm 8 mm 2500 13 in Carrier Tape, Number of Components Per Reel and Reel Size Standard Reel Component Orientation for 713 Suffix Device Pin 1 User Direction of Feed P W 3° Min. Pin 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) .040 (1.02) .020 (0.51) .015 (0.38) .008 (0.20) .310 (7.87) .290 (7.37) .400 (10.16) .310 (7.87) 8-Pin Plastic DIP Dimensions: inches (mm) |
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