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KYCSLNM1.FY-LBMB-FY-R18 Arkusz danych(PDF) 14 Page - OSRAM GmbH |
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KYCSLNM1.FY-LBMB-FY-R18 Arkusz danych(HTML) 14 Page - OSRAM GmbH |
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14 / 21 page ![]() KY CSLNM1.FY 14 Version 1.1 | 2020-10-30 Recommended Solder Pad 7) Recommended Solder Pad 7) Board selection has high impact on system reliability. For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for any kind of wet cleaning or ultrasonic cleaning. |
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