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ST87M01 Arkusz danych(PDF) 14 Page - STMicroelectronics |
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ST87M01 Arkusz danych(HTML) 14 Page - STMicroelectronics |
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14 / 20 page ![]() 7 Packaging The module is shipped in an ESD protected vacuum-sealed bag. The bag should be opened respecting the moisture sensitivity level specified in Section 4.2 Baking requirements. 7.1 Tape and reel packaging Figure 7. Tape dimensions (mm) Figure 8. Module orientation in tape ST87M01 Packaging DS14679 - Rev 1 page 14/20 |
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