Rev. 1.00

SWTS1007

8. Precautions

(1) Storage conditions

Keep the product in a dry box or a desiccator with a desiccant in order to prevent moisture absorption.

In case of being stored for more than 3 months, the product should be sealed with Nitrogen gas.

(2) After opening the package

When soldering, this could result in a decrease of the photoelectric effect or light intensity.

a. Soldering should be done right after mounting the product.

Soldering should be done within 7 days after opening the desiccant package.

If the product has been exposed for more than 7 days after opening the package or the indicating color

12 hours.

An unused and unsealed product should be repacked in a desiccant package and kept sealed in a dry

atmosphere.

(3) Precautions for use

Any external mechanical force or excessive vibration should not be applied to the product during cooling

after soldering, and it is preferable to avoid rapid cooling.

The product should not be mounted on a distorted part of PCB.

Gloves or wrist bands for ESD(Electric Static Discharge) should be wore in order to prevent ESD and

surge damage, and all devices and equipments must be grounded to the earth.

(4) Miscellaneous

Radiation resistance is not considered.

When cleaning the product, any kind of fluid such as water, oil and organic solvent must not be used

and IPA(Isopropyl Alcohol) must be used.

When using the product, operating current should be settled in consideration of the maximum ambient

temperature.

Its appearance or specification for improvement is subject to change without notice.

SEOUL SEMICONDUCTOR CO., LTD.

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SSC-QP-7-03-44(갑)