 |
Zakładka z wyszukiwarką danych komponentów |
|
|
Zakładka z wyszukiwarką danych komponentów |
|
STW5094ADLF Arkusz danych(PDF) 48 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
STW5094ADLF Arkusz danych(HTML) 48 Page - STMicroelectronics |
|
|
48 / 51 page  STw5094A 48/51 TFBGA PACKAGE OUTLINE Table 2. TFBGA 6x6x1.20 36 F6x6 0.80 (2) TFBGA stands for Thin Profile Fine Pitch Ball Grid Array. Thin profile: The total profile height (DIm A) is measured from the seating plane to the top of the component. A = 1.01 to 1.20 mm Fine pitch < 1.00 mm pitch. (3) The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink, metallized markings or other feature of package body or integral heatslug. A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1 corner. Exact shape of each corner is optional. Ref Min. Typ. Max. A1.01 1.20 (1) 1.Max mounted height is 1.16 mm. Based on a 0.37 mm ball pad diameter. Solder paste is 0.15 mm thick with 0.37 mm diameter. A1 0.21 A2 0.820 b 0.35 0.40 0.45 D 5.85 6.00 6.15 D1 4.00 E 5.85 6.00 6.15 E1 4.00 e 0.72 0.80 0.88 f 0.85 1.00 1.15 ddd 1.00 |
|
Link URL |
| Czy Alldatasheet okazała się pomocna? [ DONATE ] |
O Alldatasheet | Reklama | Kontakt | Polityka prywatności | Link do karty katalogowej | Linki | Lista producentów All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Polish ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
