MCP8021 datasheet(50/66 Pages) MICROCHIP

50 / 66 page

MCP8021/2

DS20006265D-page 50

 2020-2024 Microchip Technology Inc. and its subsidiaries

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

SECTION A-A

ROTATED 180°

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

0.50 BSC

0.203 REF

0.35

0.20

0.80

0.00

0.25

0.40

0.85

0.02

5.00 BSC

MILLIMETERS

MIN

NOM

0.45

0.30

0.90

0.05

MAX

K-

0.20

Terminal-to-Exposed-Pad

Overall Length

Exposed Pad Length

3.15

5.00 BSC

3.25

3.35

3.15

3.25

3.35

Exposed Pad Chamfer

0.35 REF

Microchip Technology Drawing C04-426 Rev D Sheet 2 of 2

28-Lead Very Thin Plastic Quad Flat, No Lead Package (9PX) - 5x5 mm Body [VQFN]

With Stepped Wettable Flanks, 3.25x3.25mm Exposed Pad

Wettable Flank Height

–

Wettable Flank Width

–

0.085

0.10

0.19

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