SAM9X75-SIP datasheet(26/36 Pages) MICROCHIP

Numer części	SAM9X75-SIP

Szczegółowy opis	SAM9X75 System-in-Package (SiP) MPU with 1‑Gbit or 2‑Gbit DDR3L SDRAM

PDF	36 Pages

Scroll/Zoom	100%

Producent	MICROCHIP [Microchip Technology]

Strona internetowa	http://www.microchip.com

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26 / 36 page

SAM9X75 SiP

Mechanical Characteristics

Data Sheet

DS60001827B - 26

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Terminal A1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

Number of Terminals

Overall Height

Ball Diameter

Overall Width

Ball Array Width

Pitch

Ball Height

Units

Dimension Limits

0.80 BSC

0.35

–

0.40

12.80 BSC

–

0.21

16.00 BSC

MILLIMETERS

MIN

NOM

243

0.45

1.23

0.312

MAX

Overall Length

Ball Array Length

16.00 BSC

12.80 BSC

Mold Thickness

0.56

0.51

0.61

243-Ball Thin Fine-Pitch Ball Grid Array (4TB) - 16x16x1.23 mm Body [TFBGA]

Microchip Technology Drawing C04-21556 Rev B

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