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information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of

whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not

in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor

reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are

registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies.

© 2020 Amkor Technology, Incorporated. All Rights Reserved. DS577I-EN Rev Date: 04/20

Visit amkor.com or email sales@amkor.com for more information.

Flip Chip CSP (fcCSP)

Standard Materials

f

Substrate

▷ Laminate: Prepreg, ABF

▷ Molded

▷ Supplier base: Extensive experience with all

major suppliers of substrates & substrate

materials

f

Bump: Cu pillar, Pb-free solder, eutectic solder

f

Underfill: Epoxy mold compound (MUF), capillary

materials (CUF)

f

Encapsulant: Epoxy mold compound

f

Solder balls: Pb-Free

Cross Sections

Test Services

f

Program generation/conversion

f

Product engineering

f

Wafer sort

f

-55°C to +165°C test available

f

Burn-in capabilities

f

Tape and reel services

Shipping

f

JEDEC trays

Bare die, capillary underfill

Exposed die molded, capillary underfill

Exposed die molded, capillary underfill

plate heatsink

Overmolded, capillary underfill

Overmolded, molded underfill

Exposed die, molded underfill

Exposed die molded, molded underfill

plate heatsink

POSSUM™ antenna in package,

molded underfill