Visit amkor.com or email sales@amkor.com for more information.

With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such

information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of

whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not

in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor

reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are

registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies.

© 2019 Amkor Technology, Incorporated. All Rights Reserved. DS230H-EN Rev Date: 07/19

TQFP

Reliability Qualification

Amkor devices are assembled in optimized package

designs with proven reliable semiconductor materials.

Commercial Qualification

f

Moisture sensitivity characterization: JEDEC level 3,

30°C/60% RH, 192 hours

f

uHAST: 130°C/85% RH, 96 hours

f

Temp cycle “C”: ‑65°C/+150°C, 500 cycles

f

High temp storage: 150°C, 1000 hours

f

AEC‑Q100 qualified

Process Highlights

f

Die thickness: 11.5 ± .5 mils

f

Strip solder plating: Matte Sn, pre‑plated Ni/Pd

frames, roughened Cu frames

f

Strip marking: Laser

f

Lead inspection: Laser/Optical

f

Wafer backgrinding available

Test Services

f

Program generation/conversion

f

Product engineering support

f

Wafer sort

f

‑55°C to +165°C test available

Shipping

f

JEDEC outline CO‑124 low‑profile tray

f

Barcode

f

Dry pack

f

Tape and reel

Cross Section TQFP

Configuration Options

TQFP Nominal Package Dimensions (mm)

Lead

Count

Body

Size

Body

Thickness

Lead

Form

Standoff

Foot

Length

Tip-to-Tip

JEDEC

Tray

Matrix

Units Per

Tray

32/40

5 x 5

1.00

1.00

0.10

0.60

7.0

MS‑026

12 x 30

360

32/48/64

7 x 7

1.00

1.00

0.10

0.60

9.0

MS‑026

10 x 25

250

44/52/64/80

10 x 10

1.00

1.00

0.10

0.60

12.0

MS‑026

8 x 20

160

80

12 x 12

1.00

1.00

0.10

0.60

14.0

MS‑026

7 x 17

119

52/64/80/100/120/128

14 x 14

1.00

1.00

0.10

0.60

16.0

MS‑026

6 x 15

90

144

16 x 16

1.00

1.00

0.10

0.60

16.0

MS‑026

6 x 15

90

144/176

20 x 20

1.00

1.00

0.10

0.60

22.0

MS‑026

5 x 12

60

Wirebond

Die attach adhesive

Mold compound

A

B

Die attach pad

Cu leadframe

C

D

E

C

A

B

E

D