Nexperia

PUSB3FA3

ESD protection for ultra high-speed interfaces

11. Soldering

SOT1176-1

Footprint information for reflow soldering of DFN2510A-10 package

solder land plus solder paste

occupied area

solder land

solder paste deposit

solder resist

Hx

By

Hy

0.05

C

P

D

0.05

Ay

Dimensions in mm

Ay

By

C

D

Hy

1.25

0.3

0.475

0.2

P

0.5

1.5

Hx

2.45

Generic footprint pattern

Refer to the package outline drawing for actual layout

sot1176-1_fr

recommended stencil thickness: 0.1 mm

Fig. 14. Reflow soldering footprint for DFN2510A-10 (SOT1176-1)

PUSB3FA3

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Nexperia B.V. 2024. All rights reserved

Product data sheet

8 August 2024

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