Nexperia

PUSB3FC4

Very low capacitance unidirectional ESD protection diode array

12. Soldering

SOT1165-3

Footprint information for reflow soldering of DFN2510-10 package

sot1165-3_fr

occupied area

solder paste

solder resist

solder land

Dimensions in mm

Issue date

recommended stencil thickness: 0.10 mm

24-03-08

0.7

(10×)

0.6

(10×)

0.55

(10×)

0.2

0.1

1.3

1.4

1.6

0.2

0.3

0.2

(8×)

0.3

(8×)

0.5

2.2

0.2

0.1

0.32

(2×)

0.4

(2×)

0.5

(2×)

2.5

2.8

Fig. 12. Reflow soldering footprint for DFN2510-10 (SOT1165-3)

PUSB3FC4

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Product data sheet

18 September 2024

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