TSL238T

HIGH-SENSITIVITY

LIGHT-TO-FREQUENCY CONVERTER

TAOS080E − JUNE 2007

9

The LUMENOLOGY r Company

r

r

Copyright E 2007, TAOS Inc.

www.taosinc.com

MANUFACTURING INFORMATION

The reflow profile specified here describes expected maximum heat exposure of devices during the solder

reflow process of the device on a PWB. Temperature is measured at the top of the device. Devices should be

limited to one pass through the solder reflow profile.

Table 1. TSL238T Solder Reflow Profile

PARAMETER

REFERENCE

TSL238T

Average temperature gradient in preheating

2.5°C/sec

Soak time

2 to 3 minutes

Max 60 sec

Max 50 sec

Max 10 sec

Peak temperature in reflow

260° C (−0°C/+5°C)

Temperature gradient in cooling

Max −5°C/sec

Not to scale — for reference only

Time (sec)

Figure 12. TSL238T Solder Reflow Profile