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Zakładka z wyszukiwarką danych komponentów |
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TSL2563CS Arkusz danych(PDF) 30 Page - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS |
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TSL2563CS Arkusz danych(HTML) 30 Page - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS |
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30 / 38 page  TSL2562, TSL2563 LOW-VOLTAGE LIGHT-TO-DIGITAL CONVERTER TAOS066J − MAY 2007 30 r r Copyright E 2007, TAOS Inc. The LUMENOLOGY r Company www.taosinc.com MECHANICAL DATA PACKAGE CS Six-Lead Chipscale Device 171 1398 465 203 1250 6 y 100 400 + 50 700 + 55 TYP 305 500 500 375 + 30 500 375 + 30 1750 TOP VIEW SIDE VIEW BOTTOM VIEW END VIEW 6 y j 250 + 30 1 2 3 6 5 4 PIN OUT BOTTOM VIEW Lead Free Pb NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 25 μm unless otherwise noted. B. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%). C. The top of the photodiode active area is 410 μm below the top surface of the package. D. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53. E. This drawing is subject to change without notice. Figure 19. Package CS — Six-Lead Chipscale Packaging Configuration |
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