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HCTL-2017 Arkusz danych(PDF) 2 Page - AVAGO TECHNOLOGIES LIMITED |
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HCTL-2017 Arkusz danych(HTML) 2 Page - AVAGO TECHNOLOGIES LIMITED |
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2 / 12 page ![]() 2 Soldering and Mounting Considerations It is recommended to use manual soldering for HCTL- 2021/2017 launch pad devices due to the characteristics of the material used in the launch pad design that not allow wave soldering. Direct mounting on printed circuit board (PCB) only is recommended for HCTL-2021/2017 launch pad devices. Mounting gap of 1mm between the base of the launch pad and customer’s printed circuit board (PCB) is required. NOTE: Precaution is required in order to avoid bend or loose pin during product handling. Length (L) Width (W) Thickness (T) HCTL-2017 22.86 ± 0.5 mm 12.70 ± 0.5 mm 1.67 ± 0.25 mm HCTL-2021 27.94 ± 0.5 mm 12.70 ± 0.5 mm 1.67 ± 0.25 mm D0 CLK SEL OE RST CH B CH A VSS VDD D1 D2 D3 D4 D5 D6 D7 1 2 3 4 5 6 7 89 10 11 12 13 14 15 16 PINOUT A VDD D1 D2 D3 CNTdec CNTcas D4 D5 D6 D7 D0 CLK SEL OE U/D NC RST CH B CH A VSS 14 15 13 12 11 16 5 17 18 19 6 7 8 9 10 4 2 3 20 1 PINOUT B (dimension in mm) HCTL-2021 SHOWN PIN DRAWING Package Dimensions with Tolerances |
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