www.ti.com

PACKAGE OUTLINE

C

3.6

3.4

2.8

2.6

1.0

0.8

0.05

0.00

2X 1.95

6X 0.65

8X

0.5

0.3

8X

0.3

0.2

2X 2.23 0.1

0.7 0.1

0.5 0.1

0.75

0.85

(0.1) TYP

(1)

VSON - 1 mm max height

DEN0008A

PLASTIC SMALL OUTLINE - NO LEAD

4228971/B 12/2023

0.08 C

0.1

C A B

0.05

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

PIN 1 INDEX AREA

SEATING PLANE

PIN 1 ID

(45 X 0.15)

PKG

EXPOSED

THERMAL PAD

SYMM

1

4

5

8

9

EXPOSED

THERMAL PAD

10

SCALE 4.000

A

B