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© 2006 Semtech Corp.

www.semtech.com

POWER MANAGEMENT

SC453

Device

Package

Temp Range(T

SC453TSTRT

TSSOP-28

-40°C to + 125°C

SC453EVB

EVALUATION BOARD

Notes:

1. Only available in tape and reel packaging. A reel contains

2500 devices.

2. Lead-free package compliant with J-STD-020B. Qualified

to support maximum IR reflow temperature of 260°C for 30

seconds.

3. This device is ESD sensitive. Use of standard ESD handling

precautions is required.

4. All parameters subject to change without notice.

5. Lead-free product. This product is fully WEEE and RoHS

compliant.

Pin#

Pin Name

Pin Function

1

DRN

This pin connects to the junction of the switching and synchronous MOSFETs.

2

TG

Output gate drive for the switching (high-side) MOSFET.

3

BST

Bootstrap pin. A capacitor is connected between BST and DRN pins to develop

the floating bootstrap voltage for the high-side MOSFET.

4

SLP

Sleep logic input signal.

5

SLPV

Connect this pin to V

is selected and the voltage on this pin sets the DAC output during sleep.

6

BOOTV

The voltage on this pin sets the BOOT-Up voltage.

7

PG#

Start clock indicator - open drain output. Active low.

8

HYS

Core Comparator Hysteresis. Connect to ground thru an external resistor called R

Hysteresis current is established by an internal V

9

VID5

VID most significant bit main controller voltage programming DAC input.

10

VID4

VID input.

Pin Configuration

Ordering Information

Pin Descriptions

1

2

3

4

5

6

7

8

V5

DRN

TOP VIEW

(28 Pin TSSOP)

27

28

15

16

BG

TG

PGND

BST

EN

SLP

CL

SLPV

CMP

BOOTV

CLRF

PG#

VCCA

HYS

9

10

22

REFIN

VID5

GND

VID4

21

18

17

19

20

11

12

24

DAC

VID3

CORE

VID2

23

25

26

13

14

PG_DEL

VID1

SS

VID0