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Zakładka z wyszukiwarką danych komponentów |
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ISD5216PI Arkusz danych(PDF) 73 Page - Winbond |
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ISD5216PI Arkusz danych(HTML) 73 Page - Winbond |
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73 / 75 page  ISD5216 Publication Release Date: Jan. 31, 2006 - 73 - Revision B.4 13. ORDERING INFORMATION Winbond Ordering Number Description When ordering, please refer to the above valid part number. Contact the local Winbond Sales Representative or Distributor for availability information. For the latest product information, access Winbond’s worldwide website at http://www.winbond- usa.com I5216 x x x Special Temperature Field: Blank = Commercial Packaged (0°C to +70°C) I = Industrial (–40°C to +85°C) Product Family ISD5216 Product (8- to 16-minute durations) Package Type: E = 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 S = 28-Lead 0.300-Inch Plastic Small Outline Package (SOIC) P = 28-Lead 0.600-Inch Plastic Dual Inline Package (PDIP) Package Option: Y = Lead-free Blank = Leaded |
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