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CD4013B Arkusz danych(PDF) 3 Page - Silicon Supplies |
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CD4013B Arkusz danych(HTML) 3 Page - Silicon Supplies |
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3 / 6 page ![]() Page 3 of 6 www.siliconsupplies.com CMOS High Voltage Logic – CD4013B Rev 1.0 21/11/17 PARAMETER SYMBOL MIN MAX UNITS Supply Voltage VDD 3.0 18 V DC Input Voltage, Output Voltage VIN, VOUT 0 VDD V Operating Temperature Range TJ -55 +125 °C Recommended Operating Conditions3 (Voltages referenced to V SS) Absolute Maximum Ratings1 PARAMETER SYMBOL VALUE UNIT DC Supply Voltage (Referenced to VSS) VDD -0.5 to +20 V DC Input or Output Voltage (Referenced to VSS) VIN, VOUT -0.5 to VDD+0.5 V Storage Temperature Range TSTG -65 to 150 °C Input Current or Output Current (per Pad) IIN, IOUT ±10 mA TJ = -55°C to 100°C 500 Power Dissipation in Still Air 2 TJ = 100°C to 125°C PD 200 mW DC Electrical Characteristics (Voltages referenced to V SS) LIMITS PARAMETER SYMBOL VDD CONDITIONS 25°C 85°C FULL RANGE 4 UNITS 5V VOUT =0.5V or VDD= -0.5V 3.5 3.5 3.5 10V VOUT =1.0V or VDD =-1.0V 7 7 7 Minimum High-Level Input Voltage VIH 15V VOUT =1.5V or VDD = -1.5V 11 11 11 V 5V VOUT =0.5V or VDD= -0.5V 1.5 1.5 1.5 10V VOUT =1.0V or VDD =-1.0V 3 3 3 Maximum Low-Level Input Voltage VIL 15V VOUT =1.5V or VDD = 1.5V 4 4 4 V 5V 4.95 4.95 4.95 10V 9.95 9.95 9.95 Minimum High-Level Output Voltage VOH 15V VIN = VSS or VDD 14.95 14.95 14.95 V 3. This device contains protection circuitry against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of voltage higher than max rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to range VSS ≤ (VIN or VOUT) ≤ VDD. Unused inputs must be tied to an appropriate logic voltage level (e.g. VSS or VDD). Unused outputs must be left open. 1. Operation above the absolute maximum rating may cause device failure. Operation at the absolute maximum ratings, for extended periods, may reduce device reliability. 2. Measured in plastic DIP package, results in die form are dependent on die attach and assembly method. 4. −55˚C ≤ TJ ≤ +125˚C |
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