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SL3S1005FUD2/HAP Arkusz danych(PDF) 4 Page - NXP Semiconductors |
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SL3S1005FUD2/HAP Arkusz danych(HTML) 4 Page - NXP Semiconductors |
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4 / 33 page ![]() NXP Semiconductors SL3S1005 UCODE 9xm 4 Ordering information Type number Package Name IC type Description Version SL3S1005FUD2/HAP Wafer UCODE 9xm Die on sawn 12" 120 µm wafer 10 µm polyimide spacer with large pads, plasma diced not applicable Table 1. Ordering information SL3S1005 All information provided in this document is subject to legal disclaimers. © 2025 NXP B.V. All rights reserved. Product data sheet Rev. 3.1 — 12 February 2025 Document feedback 4 / 33 |
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