LP4056-02

Aug.-2017

Email: marketing@lowpowersemi.com

www.lowpowersemi.com

Page 3 of 7

Preliminary Datasheet

LP4056

Function Block Diagram

6

7

2

3

5

4

TA

125℃

TDIE

CA

MA

VA

C1

C2

C3

REF

1.22V

STAT2

STAT1

SHDN

TO BAT

2.9V

VCC

3μA

R3

1V

R4

0.1V

R5

ISET

GND

R2

R1

BAT

VIN

5μA

1000X

1X

+

+

+

+

+

+

-

-

-

-

-

-

Absolute Maximum Ratings

Note1



Input to GND(VIN) ----------------------------------------------------------------------------------------------------- -0.3V to 8V



Other Pin to GND ------------------------------------------------------------------------------------------------------ -0.3V to 6V



BAT Short-circuit Duration ------------------------------------------------------------------------------------------- Continuous



Maximum Junction Temperature ----------------------------------------------------------------------------------------- 125℃



Operating Ambient Temperature Range (TA) ---------------------------------------------------------------- -20℃ to 85℃



Storage Temperature---------------------------------------------------------------------------------------------- -45℃ to 165℃



Maximum Soldering Temperature (at leads, 10 sec)

-------------------------------------------------------------- 260℃

Note1. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Thermal Information



Maximum Power Dissipation (ESOP8, PD, TA=25°C) ------------------------------------------------------------------ 2W



Thermal Resistance (ESOP8, θJA) ------------------------------------------------------------------------------------- 50℃/W