April 05 REVISION 02

SHEET 15 OF 16

Technical Reference Note

Ultra Low Profile

AVC 20W Series

Reflow Soldering Information

Soldering

I) Flux

Solder the products with Rosin Flux (0.2wt%. chloride or less).

Do not use acid or soluble flux, because they may damage metallic parts and glass

parts and may cause defective or reduce quality.

II) Solder

SnAgCu solder compatible

III) Recommendable Solder Land Pattern

IV) Condition of Soldering – Recommended soldering profile (J-STD-020C):

Reflow Profile

:

Infrared or air blow

Preheating

:

150 – 200 deg C for 60 to 150sec

Peak temperature :

240

± 5 deg C at surface.

Maximum period above 220deg.C :

20 – 60seC

Ramp rate

:

lower than 4 deg C / sec

Times

:

1 time

35.2

2.6

P = 2.54