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MMA047CP4/TR Arkusz danych(PDF) 16 Page - Microchip Technology |
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MMA047CP4/TR Arkusz danych(HTML) 16 Page - Microchip Technology |
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16 / 24 page ![]() MMA047CP4 Package Specifications Data Sheet © 2024 Microchip Technology Inc. and its subsidiaries DS00005609A - 16 2. Package Specifications Figure 2-1. Package Outline Drawing Table 2-1. I/O Description Pin Number Pin Name Pin Description 4, 5 RFIN These pads are DC-coupled to 50Ω termination and matched to 50Ω RF. 15, 16 RFOUT These pads are decoupled from DC and matched to 50Ω RF. 22 VDD VDD bias supply 10, 11 VGA, VGB Connect to RF/DC ground 9 VSB Used to control bias current (See Table 3-1 below) 3, 6, 14, 17 and Backside Paddle Ground 1, 2, 7, 8, 12, 13, 18, 19, 20, 21, 23, 24 N/C Not connected internally, but recommend they are grounded on the PCB. |
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