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SC14WAMDECTSF01T Arkusz danych(PDF) 32 Page - Renesas Technology Corp |
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SC14WAMDECTSF01T Arkusz danych(HTML) 32 Page - Renesas Technology Corp |
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32 / 37 page ![]() Datasheet Revision 3.1 05-Jan-2022 CFR0011-120-00-FM Rev 5 32 of 36 © 2022 Renesas Electronics SC14WAMDECT SF Wireless Audio Module FINAL 10.3 COPPER PAD, SOLDER OPENING AND STEN- CIL For the stencil a thickness of 0.130 mm is recommended. Recommended copper pad, solder mask opening and stencil are shown below. Figure 18: Pad types and dimensions |
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